LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3741EUF-1#PBF | (Engineering Calculation) | QFN 4mm X 4mm Exp. Pad | ||||||
| (printed on: 2017-03-17 00:08:24) | TOTAL MASS (g): | 0.038832 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000976 | 1000000 | 25134.109375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.015239 | 975000 | 392437.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000375 | 24000 | 9657.06054688 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000005 | 300 | 128.760803223 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000011 | 700 | 283.273773193 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.015630 | 1000000 | 402506.25 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000734 | 1000000 | 18894.1679688 | ||||
| External Plating Total: | 0.000734 | 1000000 | 18894.1679688 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000347 | 1000000 | 8936 | ||||
| Internal Plating Total: | 0.000347 | 1000000 | 8936 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000566 | 750000 | 14575.7236328 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000189 | 250000 | 4867.15820312 | |||||
| Die Attach Total: | 0.000755 | 1000000 | 19442.8808594 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002640 | 130000 | 67985.703125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.017467 | 860000 | 449812.96875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000203 | 10000 | 5227.68847656 | ||||
| Encapsulation Total: | 0.020310 | 1000000 | 523026.40625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000080 | 1000000 | 2060.17285156 | ||
| TOTAL MASS (g): | 0.038832 | |||||||