LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3724EFE#TRPBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-17 04:15:57) | TOTAL MASS (g): | 0.062622 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006088 | 1000000 | 97217.9765625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.018525 | 975000 | 295821.8125 | ||
| Iron (Fe) | 7439-89-6 | 0.000456 | 24000 | 7281.76757812 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 300 | 95.8127365112 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000013 | 700 | 207.59425354 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.019000 | 1000000 | 303406.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002537 | 1000000 | 40515.3046875 | ||||
| External Plating Total: | 0.002537 | 1000000 | 40515.3046875 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000250 | 1000000 | 3992.19702148 | ||||
| Internal Plating Total: | 0.000250 | 1000000 | 3992.19702148 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001491 | 750000 | 23809.4628906 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000497 | 250000 | 7936.48779297 | |||||
| Die Attach Total: | 0.001988 | 1000000 | 31745.9511719 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004875 | 150000 | 77847.84375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.026650 | 820000 | 425568.21875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000813 | 25000 | 12982.6259766 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000163 | 5000 | 2602.91259766 | ||||
| Encapsulation Total: | 0.032501 | 1000000 | 519001.59375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000258 | 1000000 | 4119.94726562 | ||
| TOTAL MASS (g): | 0.062622 | |||||||