LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3695HMSE-5#TRPBF | (Engineering Calculation) | MSOP-Exposed | ||||||
| (printed on: 2017-03-17 04:14:39) | TOTAL MASS (g): | 0.036307 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001489 | 1000000 | 41011.3476562 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013845 | 975000 | 381331.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000341 | 24000 | 9392.12207031 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 110.171516418 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000010 | 700 | 275.428771973 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.014200 | 1000000 | 391108.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000710 | 1000000 | 19556.1308594 | ||||
| External Plating Total: | 0.000710 | 1000000 | 19556.1308594 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 2368.68774414 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 2368.68774414 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000569 | 750000 | 15671.8974609 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000190 | 250000 | 5233.14697266 | |||||
| Die Attach Total: | 0.000759 | 1000000 | 20905.0449219 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002439 | 130000 | 67177.078125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.015571 | 830000 | 428870.15625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000657 | 35000 | 18095.6699219 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000094 | 5000 | 2589.03076172 | ||||
| Encapsulation Total: | 0.018761 | 1000000 | 516731.90625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000302 | 1000000 | 8317.94921875 | ||
| TOTAL MASS (g): | 0.036307 | |||||||