LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT3669EUFD-2#PBF | (Engineering Calculation) | QFN 4mm X 5mm Exp. Pad | ||||||
| (printed on: 2017-03-16 19:41:39) | TOTAL MASS (g): | 0.051177 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004436 | 1000000 | 86679.203125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.019997 | 975000 | 390740.375 | ||
| Iron (Fe) | 7439-89-6 | 0.000492 | 24000 | 9613.65527344 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000006 | 300 | 117.239692688 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000014 | 700 | 273.559265137 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.020509 | 1000000 | 400744.8125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000227 | 1000000 | 4439.63232422 | ||||
| External Plating Total: | 0.000227 | 1000000 | 4439.63232422 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000429 | 1000000 | 8382.63769531 | ||||
| Internal Plating Total: | 0.000429 | 1000000 | 8382.63769531 | |||||
| Die Attach | ELECTRICALLY INSULATING ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000018 | 50000 | 351.719085693 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000106 | 300000 | 2071.23461914 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000230 | 650000 | 4494.18847656 | |||||
| Die Attach Total: | 0.000354 | 1000000 | 6917.14160156 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.003244 | 130000 | 63387.59375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.021457 | 860000 | 419268.65625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000250 | 10000 | 4884.98779297 | ||||
| Encapsulation Total: | 0.024951 | 1000000 | 487541.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000271 | 1000000 | 5295.32617188 | ||
| TOTAL MASS (g): | 0.051177 | |||||||