LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT3090MPMSE | (Engineering Calculation) | MSOP-Exposed | ||||||
| (printed on: 2017-03-16 16:59:44) | TOTAL MASS (g): | 0.0372329987586 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002698 | 1000000 | 72463 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013845 | 975000 | 371848 | ||
| Iron (Fe) | 7439-89-6 | 0.000341 | 24000 | 9159 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 107 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000010 | 700 | 269 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.014200 | 1000000 | 381383 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000112 | 149333 | 3008 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000638 | 850667 | 17135 | ||||
| External Plating Total: | 0.000750 | 1000000 | 20143 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 2310 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 2310 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000419 | 820000 | 11253 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000092 | 180000 | 2471 | |||||
| Die Attach Total: | 0.000511 | 1000000 | 13724 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002439 | 130000 | 65506 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.015571 | 830000 | 418204 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000657 | 35000 | 17646 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000094 | 5000 | 2525 | ||||
| Encapsulation Total: | 0.018761 | 1000000 | 503881 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000227 | 1000000 | 6097 | ||
| TOTAL MASS (g): | 0.037233 | |||||||