LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3089EFE#PBF | (Engineering Calculation) | DFN 4mm X 4mm Exp. Pad | ||||||
| (printed on: 2017-03-16 16:43:38) | TOTAL MASS (g): | 0.036803 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001909 | 1000000 | 51870.3164062 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.012129 | 975000 | 329562.625 | ||
| Iron (Fe) | 7439-89-6 | 0.000291 | 23400 | 7906.89404297 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000010 | 800 | 271.714569092 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000010 | 800 | 271.714569092 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.012440 | 1000000 | 338012.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000580 | 1000000 | 15768.3339844 | ||||
| External Plating Total: | 0.000580 | 1000000 | 15768.3339844 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000278 | 1000000 | 7553.66552734 | ||||
| Internal Plating Total: | 0.000278 | 1000000 | 7553.66552734 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000356 | 800000 | 9673.0390625 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000089 | 200000 | 2418.25976562 | |||||
| Die Attach Total: | 0.000445 | 1000000 | 12091.2998047 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.002739 | 130000 | 74422.6171875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.018120 | 860000 | 492346.84375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000211 | 10000 | 5733.17822266 | ||||
| Encapsulation Total: | 0.021070 | 1000000 | 572502.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000081 | 1000000 | 2200.88818359 | ||
| TOTAL MASS (g): | 0.036803 | |||||||