LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3088MPM (Engineering Calculation) DDPAK  
(printed on: 2017-03-16 16:50:58) TOTAL MASS (g): 1.37166798115
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002236 1000000 1630
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.827657 998500 603395
Iron (Fe) 7439-89-6 0.000000 0 0
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.001243 1500 906
Lead Frame Total: 0.828900 1000000 604301
Plating PMI Exter. Plating Pb 7439-92-1 0.001530 149560 1115
Exter. Plating Sn 7440-31-5 0.008700 850440 6343
External Plating Total: 0.010230 1000000 7458
Inter. Plating Ni 7440-02-0 0.005000 781250 3645
Inter. Plating Ag 7440-22-4 0.001400 218750 1021
Internal Plating Total: 0.006400 1000000 4666
Die Attach 95Pb / 5 Sn Silver (Ag) 7440-22-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000065 50000 47
Lead (Pb) 7439-92-1 0.001244 950000 907
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000000 0 0
Die Attach Total: 0.001309 1000000 954
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.053704 103000 39152
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.466653 895000 340208
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.001043 2000 760
Encapsulation Total: 0.521400 1000000 380120
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.001193 1000000 870
  TOTAL MASS (g): 1.371668