LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3083MPDF#TR (Engineering Calculation) DFN 4mm X 4mm Exp. Pad  
(printed on: 2017-03-16 16:53:11) TOTAL MASS (g): 0.0372719988227
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.002278 1000000 61118
Die Coat Dow Corning Silicone 69430-27-9 0.000000 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.012129 975000 325419
Iron (Fe) 7439-89-6 0.000291 23400 7807
Phosphorus (P) 7723-14-0 0.000010 800 268
Zinc (Zn) 7440-66-6 0.000010 800 268
Nickel (Ni) 7440-02-0 0.000000 0 0
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.012440 1000000 333762
Plating PMI Exter. Plating Pb 7439-92-1 0.000092 150082 2468
Exter. Plating Sn 7440-31-5 0.000521 849918 13978
External Plating Total: 0.000613 1000000 16446
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000278 1000000 7459
Internal Plating Total: 0.000278 1000000 7459
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000410 800000 11000
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000102 200000 2737
Die Attach Total: 0.000512 1000000 13737
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.002739 130000 73487
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.018120 860000 486156
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.000000 0 0
Carbon Black (C) 1333-86-4 0.000211 10000 5661
Encapsulation Total: 0.021070 1000000 565304
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000081 1000000 2173
  TOTAL MASS (g): 0.037272