LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3081IR#TRPBF | (Engineering Calculation) | DDPAK | ||||||
| (printed on: 2017-03-16 16:59:17) | TOTAL MASS (g): | 1.405096 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004033 | 1000000 | 2870.2668457 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.852419 | 998500 | 606662.5 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.001281 | 1500 | 911.681518555 | ||||
| Lead Frame Total: | 0.853700 | 1000000 | 607574.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010925 | 1000000 | 7775.21142578 | ||||
| External Plating Total: | 0.010925 | 1000000 | 7775.21142578 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.005000 | 714285.6875 | 3558.47583008 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002000 | 285714.28125 | 1423.39050293 | ||||
| Internal Plating Total: | 0.007000 | 1000000 | 4981.86669922 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000098 | 50000 | 69.7461242676 | ||||
| Lead (Pb) | 7439-92-1 | 0.001857 | 950000 | 1321.61791992 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.001955 | 1000000 | 1391.36401367 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.054044 | 103000 | 38462.8554688 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.469607 | 895000 | 334217.03125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001049 | 2000 | 746.56817627 | ||||
| Encapsulation Total: | 0.524700 | 1000000 | 373426.4375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.002783 | 1000000 | 1980.64770508 | ||
| TOTAL MASS (g): | 1.405096 | |||||||