LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3081HFE#TRPBF | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-16 16:59:28) | TOTAL MASS (g): | 0.104197 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004033 | 1000000 | 38705.5625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.025576 | 975000 | 245458.3125 | ||
| Iron (Fe) | 7439-89-6 | 0.000630 | 24000 | 6046.24462891 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000008 | 300 | 76.7777099609 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000018 | 700 | 172.749847412 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.026232 | 1000000 | 251754.109375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002364 | 1000000 | 22686.9453125 | ||||
| External Plating Total: | 0.002364 | 1000000 | 22686.9453125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001030 | 1000000 | 9885.13085938 | ||||
| Internal Plating Total: | 0.001030 | 1000000 | 9885.13085938 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000549 | 820000 | 5268.87011719 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000120 | 180000 | 1151.66552734 | |||||
| Die Attach Total: | 0.000669 | 1000000 | 6420.53564453 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004875 | 150000 | 46786.4179688 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.026650 | 820000 | 255765.734375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000813 | 25000 | 7802.53417969 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000163 | 5000 | 1564.3458252 | ||||
| Encapsulation Total: | 0.032501 | 1000000 | 311919.03125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.037368 | 1000000 | 358628.65625 | ||
| TOTAL MASS (g): | 0.104197 | |||||||