LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3065HMSE-1.2#PBF | (Engineering Calculation) | MSOP-Exposed | ||||||
| (printed on: 2017-03-17 04:08:33) | TOTAL MASS (g): | 0.036538 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002111 | 1000000 | 57775.4296875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013845 | 975000 | 378920.34375 | ||
| Iron (Fe) | 7439-89-6 | 0.000341 | 24000 | 9332.74316406 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000004 | 300 | 109.474998474 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000010 | 700 | 273.687469482 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.014200 | 1000000 | 388636.21875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000710 | 1000000 | 19432.4941406 | ||||
| External Plating Total: | 0.000710 | 1000000 | 19432.4941406 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 2353.71240234 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 2353.71240234 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000364 | 820000 | 9962.22558594 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000080 | 180000 | 2189.49975586 | |||||
| Die Attach Total: | 0.000444 | 1000000 | 12151.7246094 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001932 | 103000 | 52876.4257812 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.016790 | 895000 | 459521.3125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000038 | 2000 | 1040.01245117 | ||||
| Encapsulation Total: | 0.018760 | 1000000 | 513437.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000227 | 1000000 | 6212.70556641 | ||
| TOTAL MASS (g): | 0.036538 | |||||||