LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3032MPDE-15#PBF | (Engineering Calculation) | DFN 4mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 00:13:04) | TOTAL MASS (g): | 0.030154 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000673 | 1000000 | 22318.9355469 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.013131 | 974800.0625 | 435467.96875 | ||
| Iron (Fe) | 7439-89-6 | 0.000317 | 23500 | 10512.7822266 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000011 | 850 | 364.796875 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000011 | 850 | 364.796875 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.013470 | 1000000 | 446710.3125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000626 | 1000000 | 20752.5878906 | ||||
| External Plating Total: | 0.000626 | 1000000 | 20752.5878906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000302 | 1000000 | 10015.3320312 | ||||
| Internal Plating Total: | 0.000302 | 1000000 | 10015.3320312 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000448 | 750000 | 14857.1816406 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000149 | 250000 | 4941.33935547 | |||||
| Die Attach Total: | 0.000597 | 1000000 | 19798.5214844 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001876 | 130000 | 62214.4453125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.012410 | 860000 | 411557.1875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000144 | 10000 | 4775.52294922 | ||||
| Encapsulation Total: | 0.014430 | 1000000 | 478547.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000056 | 1000000 | 1857.14770508 | ||
| TOTAL MASS (g): | 0.030154 | |||||||