LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT3021EDH-1.5#PBF | (Engineering Calculation) | DFN 5mm x 5mm Exp. Pad | ||||||
| (printed on: 2017-03-17 03:59:05) | TOTAL MASS (g): | 0.066231 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003031 | 1000000 | 45763.8515625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.028850 | 975000 | 435594.53125 | ||
| Iron (Fe) | 7439-89-6 | 0.000710 | 24000 | 10720.0039062 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000009 | 300 | 135.887390137 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000021 | 700 | 317.070556641 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.029590 | 1000000 | 446767.46875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001415 | 1000000 | 21369.2929688 | ||||
| External Plating Total: | 0.001415 | 1000000 | 21369.2929688 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000647 | 1000000 | 9768.79199219 | ||||
| Internal Plating Total: | 0.000647 | 1000000 | 9768.79199219 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001223 | 750000 | 18465.5839844 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000408 | 250000 | 6160.22753906 | |||||
| Die Attach Total: | 0.001631 | 1000000 | 24625.8125 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.003875 | 130000 | 58507.0625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.025637 | 860000 | 387082.75 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000298 | 10000 | 4499.38183594 | ||||
| Encapsulation Total: | 0.029810 | 1000000 | 450089.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000107 | 1000000 | 1615.54992676 | ||
| TOTAL MASS (g): | 0.066231 | |||||||