LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT3020EMS8-1.2#PBF | (Engineering Calculation) | MSOP | ||||||
| (printed on: 2017-03-17 03:49:57) | TOTAL MASS (g): | 0.027052 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001815 | 1000000 | 67092.9375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.010433 | 975000 | 385664.25 | ||
| Iron (Fe) | 7439-89-6 | 0.000257 | 24000 | 9500.21289062 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000003 | 300 | 110.897422791 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000007 | 700 | 258.760650635 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.010700 | 1000000 | 395534.15625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000710 | 1000000 | 26246.6464844 | ||||
| External Plating Total: | 0.000710 | 1000000 | 26246.6464844 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000086 | 1000000 | 3179.05932617 | ||||
| Internal Plating Total: | 0.000086 | 1000000 | 3179.05932617 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000668 | 750000 | 24693.1621094 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000223 | 250000 | 8243.375 | |||||
| Die Attach Total: | 0.000891 | 1000000 | 32936.53125 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001659 | 130000 | 61326.2734375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.010591 | 830000 | 391504.875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000447 | 35000 | 16523.7148438 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000064 | 5000 | 2365.81176758 | ||||
| Encapsulation Total: | 0.012761 | 1000000 | 471720.65625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000089 | 1000000 | 3289.95678711 | ||
| TOTAL MASS (g): | 0.027052 | |||||||