LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3015ET-3#PBF | (Engineering Calculation) | TO-220 | ||||||
| (printed on: 2017-03-17 00:12:14) | TOTAL MASS (g): | 1.98788 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002740 | 1000000 | 1378.35253906 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 1.428754 | 998500 | 718732.375 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.002146 | 1500 | 1079.54187012 | ||||
| Lead Frame Total: | 1.430900 | 1000000 | 719811.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.011398 | 1000000 | 5733.88037109 | ||||
| External Plating Total: | 0.011398 | 1000000 | 5733.88037109 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.010000 | 834028.375 | 5030.48388672 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001990 | 165971.640625 | 1001.06628418 | ||||
| Internal Plating Total: | 0.011990 | 1000000 | 6031.54980469 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000075 | 50000 | 37.7286300659 | ||||
| Lead (Pb) | 7439-92-1 | 0.001433 | 950000 | 720.868286133 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.001508 | 1000000 | 758.596923828 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.054270 | 103000 | 27300.4355469 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.471567 | 895000 | 237221.015625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001054 | 2000 | 530.213012695 | ||||
| Encapsulation Total: | 0.526891 | 1000000 | 265051.65625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000307 | 1000000 | 154.435852051 | ||
| TOTAL MASS (g): | 1.987880 | |||||||