LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3015EQ#PBF | (Engineering Calculation) | DDPAK | ||||||
| (printed on: 2017-03-17 00:12:15) | TOTAL MASS (g): | 1.395844 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002740 | 1000000 | 1962.96972656 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.852419 | 998500 | 610683.5 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.001281 | 1500 | 917.724182129 | ||||
| Lead Frame Total: | 0.853700 | 1000000 | 611601.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.009978 | 1000000 | 7148.51806641 | ||||
| External Plating Total: | 0.009978 | 1000000 | 7148.51806641 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.004000 | 740740.75 | 2865.64941406 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001400 | 259259.265625 | 1002.97723389 | ||||
| Internal Plating Total: | 0.005400 | 1000000 | 3868.62670898 | |||||
| Die Attach | 95 Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000075 | 50000 | 53.7309265137 | ||||
| Lead (Pb) | 7439-92-1 | 0.001433 | 950000 | 1026.61889648 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.001508 | 1000000 | 1080.34973145 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.053704 | 103000 | 38474.2109375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466653 | 895000 | 334315.96875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001043 | 2000 | 747.218078613 | ||||
| Encapsulation Total: | 0.521400 | 1000000 | 373537.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001118 | 1000000 | 800.948974609 | ||
| TOTAL MASS (g): | 1.395844 | |||||||