LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3013MPFE#TR | (Engineering Calculation) | TSSOP Exp. Pad | ||||||
| (printed on: 2017-03-19 05:57:11) | TOTAL MASS (g): | 0.0674720034003 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003515 | 1000000 | 52096 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.025576 | 975000 | 379061 | ||
| Iron (Fe) | 7439-89-6 | 0.000630 | 24000 | 9337 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000008 | 300 | 119 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000018 | 700 | 267 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.026232 | 1000000 | 388784 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000383 | 153384 | 5676 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002114 | 846616 | 31332 | ||||
| External Plating Total: | 0.002497 | 1000000 | 37008 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001030 | 1000000 | 15266 | ||||
| Internal Plating Total: | 0.001030 | 1000000 | 15266 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001034 | 750000 | 15325 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000345 | 250000 | 5113 | |||||
| Die Attach Total: | 0.001379 | 1000000 | 20438 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.003348 | 103000 | 49621 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.029088 | 895000 | 431112 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000065 | 2000 | 963 | ||||
| Encapsulation Total: | 0.032501 | 1000000 | 481696 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000318 | 1000000 | 4713 | ||
| TOTAL MASS (g): | 0.067472 | |||||||