LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3011EDD#TRPBF | (Engineering Calculation) | DFN 3mm X 3mm Exp. Pad | ||||||
| (printed on: 2017-03-17 04:04:19) | TOTAL MASS (g): | 0.02367 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001510 | 1000000 | 63792.8554688 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.009711 | 975000 | 410259.875 | ||
| Iron (Fe) | 7439-89-6 | 0.000239 | 24000 | 10097.0146484 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000003 | 300 | 126.740776062 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000007 | 700 | 295.728485107 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.009960 | 1000000 | 420779.375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000455 | 1000000 | 19237.6738281 | ||||
| External Plating Total: | 0.000455 | 1000000 | 19237.6738281 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000225 | 1000000 | 9505.55761719 | ||||
| Internal Plating Total: | 0.000225 | 1000000 | 9505.55761719 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000750 | 750000 | 31685.1914062 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000250 | 250000 | 10561.7314453 | |||||
| Die Attach Total: | 0.001000 | 1000000 | 42246.9257812 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.001153 | 110000 | 48710.703125 | |||
| Bromine (Br) | 40039-93-8 | 0.000105 | 10000 | 4435.92724609 | ||||
| Silica (SiO2) | 60676-86-0 | 0.008908 | 850000 | 376335.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000314 | 30000 | 13265.5341797 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.010480 | 1000000 | 442747.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000040 | 1000000 | 1689.87695312 | ||
| TOTAL MASS (g): | 0.023670 | |||||||