LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT3009ESC8-3.3#TRMPBF | (Engineering Calculation) | SC70 | ||||||
| (printed on: 2017-03-17 04:23:56) | TOTAL MASS (g): | 0.01042 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000464 | 1000000 | 44529.2421875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.003442 | 975000 | 330322.5 | ||
| Iron (Fe) | 7439-89-6 | 0.000085 | 24000 | 8157.29589844 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 300 | 95.9681930542 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000002 | 700 | 191.936386108 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.003530 | 1000000 | 338767.71875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.003408 | 1000000 | 327071.09375 | ||||
| External Plating Total: | 0.003408 | 1000000 | 327071.09375 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000023 | 1000000 | 2207.26855469 | ||||
| Internal Plating Total: | 0.000023 | 1000000 | 2207.26855469 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000289 | 750000 | 27734.8066406 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000096 | 250000 | 9212.94628906 | |||||
| Die Attach Total: | 0.000385 | 1000000 | 36947.7539062 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000147 | 58000 | 14107.3242188 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.002261 | 890000 | 216984.078125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000127 | 50000 | 12187.9609375 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000005 | 2000 | 479.840942383 | ||||
| Encapsulation Total: | 0.002540 | 1000000 | 243759.203125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000070 | 1000000 | 6717.7734375 | ||
| TOTAL MASS (g): | 0.010420 | |||||||