LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1935ES5#TRPBF | (Engineering Calculation) | TSOT FCOL (FlipChip) | ||||||
| (printed on: 2017-03-17 04:13:13) | TOTAL MASS (g): | 0.01484 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002003 | 1000000 | 134974.234375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.005530 | 975000 | 372644.875 | ||
| Iron (Fe) | 7439-89-6 | 0.000136 | 24000 | 9164.50292969 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000002 | 300 | 134.772094727 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000004 | 700 | 269.544189453 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.005672 | 1000000 | 382213.65625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000038 | 1000000 | 2551.7746582 | ||||
| External Plating Total: | 0.000038 | 1000000 | 2551.7746582 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000000 | 0 | 0 | ||||
| Internal Plating Total: | 0.000000 | 0 | 0 | |||||
| Die Attach | 75Pb25In | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000875 | 750000 | 58962.7929688 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000292 | 250000 | 19676.7265625 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.001167 | 1000000 | 78639.5234375 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000346 | 58000 | 23315.5703125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.005304 | 890000 | 357415.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000298 | 50000 | 20081.0410156 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000012 | 2000 | 808.632568359 | ||||
| Encapsulation Total: | 0.005960 | 1000000 | 401620.875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000000 | 0 | 0 | ||
| TOTAL MASS (g): | 0.014840 | |||||||