LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT1881ACS8#TRPBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-16 17:27:30) | TOTAL MASS (g): | 0.07559 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003813 | 1000000 | 50443.28125 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000159 | 1000000 | 2103.45703125 | ||
| Lead Frame | A42 | Copper (Cu) | 7440-50-8 | 0.000000 | 0 | 0 | ||
| Iron (Fe) | 7439-89-6 | 0.014071 | 580000 | 186149.328125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.010189 | 420000 | 134793.21875 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024260 | 1000000 | 320942.5625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001477 | 1000000 | 19537.703125 | ||||
| External Plating Total: | 0.001477 | 1000000 | 19537.703125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000194 | 1000000 | 2566.48193359 | ||||
| Internal Plating Total: | 0.000194 | 1000000 | 2566.48193359 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001071 | 750000 | 14168.5693359 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000357 | 250000 | 4722.85644531 | |||||
| Die Attach Total: | 0.001428 | 1000000 | 18891.4257812 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006611 | 150000 | 87458.828125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036141 | 820000 | 478119.75 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001102 | 25000 | 14578.6767578 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000220 | 5000 | 2910.44360352 | ||||
| Encapsulation Total: | 0.044074 | 1000000 | 583067.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000185 | 1000000 | 2447.41845703 | ||
| TOTAL MASS (g): | 0.075590 | |||||||