LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT1794ISW#PBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-16 21:39:13) | TOTAL MASS (g): | 0.544355 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006232 | 1000000 | 11448.4169922 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.153163 | 975000 | 281366.15625 | ||
| Iron (Fe) | 7439-89-6 | 0.003770 | 24000 | 6925.63085938 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000047 | 300 | 86.3407592773 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000110 | 700 | 202.074111938 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.157090 | 1000000 | 288580.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005974 | 1000000 | 10973.8681641 | ||||
| External Plating Total: | 0.005974 | 1000000 | 10973.8681641 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001257 | 1000000 | 2309.15600586 | ||||
| Internal Plating Total: | 0.001257 | 1000000 | 2309.15600586 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001556 | 750000 | 2858.43017578 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000519 | 250000 | 953.422363281 | |||||
| Die Attach Total: | 0.002075 | 1000000 | 3811.85253906 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.038213 | 103000 | 70198.7109375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.332045 | 895000 | 609979.0625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000742 | 2000 | 1363.08178711 | ||||
| Encapsulation Total: | 0.371000 | 1000000 | 681540.875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000727 | 1000000 | 1335.52624512 | ||
| TOTAL MASS (g): | 0.544355 | |||||||