LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1684CN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 01:23:41) | TOTAL MASS (g): | 0.986223 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002887 | 1000000 | 2927.33056641 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.284310 | 975000 | 288281.75 | ||
| Iron (Fe) | 7439-89-6 | 0.006998 | 24000 | 7095.75976562 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000087 | 300 | 88.2153625488 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000204 | 700 | 206.84979248 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.291599 | 1000000 | 295672.53125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.021727 | 1000000 | 22030.2792969 | ||||
| External Plating Total: | 0.021727 | 1000000 | 22030.2792969 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002333 | 1000000 | 2365.59130859 | ||||
| Internal Plating Total: | 0.002333 | 1000000 | 2365.59130859 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000883 | 750000 | 895.335144043 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000294 | 250000 | 298.107086182 | |||||
| Die Attach Total: | 0.001177 | 1000000 | 1193.44226074 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.159840 | 240000 | 162072.90625 | |||
| Bromine (Br) | 40039-93-8 | 0.006660 | 10000 | 6753.03759766 | ||||
| Silica (SiO2) | 60676-86-0 | 0.479520 | 720000 | 486218.71875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.019980 | 30000 | 20259.1132812 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.666000 | 1000000 | 675303.8125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000500 | 1000000 | 506.984832764 | ||
| TOTAL MASS (g): | 0.986223 | |||||||