LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT1630CN8#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 17:17:41) | TOTAL MASS (g): | 0.501798 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004397 | 1000000 | 8762.484375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000245 | 1000000 | 488.24395752 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.149760 | 975000 | 298446.5625 | ||
| Iron (Fe) | 7439-89-6 | 0.003686 | 24000 | 7345.58007812 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000046 | 300 | 91.6702957153 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000108 | 700 | 215.225906372 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.153600 | 1000000 | 306099.09375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012410 | 1000000 | 24731.6308594 | ||||
| External Plating Total: | 0.012410 | 1000000 | 24731.6308594 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001228 | 1000000 | 2447.19848633 | ||||
| Internal Plating Total: | 0.001228 | 1000000 | 2447.19848633 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001189 | 750000 | 2369.47753906 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000396 | 250000 | 789.161682129 | |||||
| Die Attach Total: | 0.001585 | 1000000 | 3158.6394043 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.044286 | 135000 | 88254.578125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.282121 | 860000 | 562219.9375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001640 | 5000 | 3268.24536133 | ||||
| Encapsulation Total: | 0.328047 | 1000000 | 653742.75 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000286 | 1000000 | 569.950073242 | ||
| TOTAL MASS (g): | 0.501798 | |||||||