LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1575CS8-3.3#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-16 17:45:57) | TOTAL MASS (g): | 0.073368 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002026 | 1000000 | 27614.2773438 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023653 | 975000 | 322389.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000582 | 24000 | 7932.63037109 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000007 | 300 | 95.4096374512 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000017 | 700 | 231.709121704 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024259 | 1000000 | 330648.90625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001477 | 1000000 | 20129.4160156 | ||||
| External Plating Total: | 0.001477 | 1000000 | 20129.4160156 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000194 | 1000000 | 2644.20996094 | ||||
| Internal Plating Total: | 0.000194 | 1000000 | 2644.20996094 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000692 | 750000 | 9431.92382812 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000231 | 250000 | 3148.51806641 | |||||
| Die Attach Total: | 0.000923 | 1000000 | 12580.4423828 | |||||
| Encapsulation | DCPD RESIN | Resin (EP) | 0.004882 | 110000 | 66541.4140625 | |||
| Bromine (Br) | 40039-93-8 | 0.000444 | 10000 | 6051.69726562 | ||||
| Silica (SiO2) | 60676-86-0 | 0.037723 | 850000 | 514162.53125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.001331 | 30000 | 18141.4609375 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.044380 | 1000000 | 604897.125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000109 | 1000000 | 1485.66442871 | ||
| TOTAL MASS (g): | 0.073368 | |||||||