LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1506CR-SYNC#PBF | (Engineering Calculation) | DDPAK | ||||||
| (printed on: 2017-03-17 22:53:16) | TOTAL MASS (g): | 1.407791 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005059 | 1000000 | 3593.57348633 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.852419 | 998500 | 605501.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.001281 | 1500 | 909.936279297 | ||||
| Lead Frame Total: | 0.853700 | 1000000 | 606411.0625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.010925 | 1000000 | 7760.32666016 | ||||
| External Plating Total: | 0.010925 | 1000000 | 7760.32666016 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.005000 | 714285.6875 | 3551.66381836 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002000 | 285714.28125 | 1420.66564941 | ||||
| Internal Plating Total: | 0.007000 | 1000000 | 4972.32958984 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000117 | 50000 | 83.1089324951 | ||||
| Lead (Pb) | 7439-92-1 | 0.002226 | 950000 | 1581.20080566 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.002343 | 1000000 | 1664.30969238 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.054044 | 103000 | 38389.2226562 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.469607 | 895000 | 333577.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001049 | 2000 | 745.139038086 | ||||
| Encapsulation Total: | 0.524700 | 1000000 | 372711.59375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.002783 | 1000000 | 1976.8560791 | ||
| TOTAL MASS (g): | 1.407791 | |||||||