LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT1491AIN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 20:56:10) | TOTAL MASS (g): | 0.985002 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001976 | 1000000 | 2006.08764648 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000110 | 1000000 | 111.674926758 | ||
| Lead Frame | A42 | Copper (Cu) | 7440-50-8 | 0.000000 | 0 | 0 | ||
| Iron (Fe) | 7439-89-6 | 0.169128 | 580000 | 171703.234375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.122472 | 420000 | 124336.828125 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.291600 | 1000000 | 296040.0625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.021727 | 1000000 | 22057.5878906 | ||||
| External Plating Total: | 0.021727 | 1000000 | 22057.5878906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002333 | 1000000 | 2368.52368164 | ||||
| Internal Plating Total: | 0.002333 | 1000000 | 2368.52368164 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000686 | 750000 | 696.44543457 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000229 | 250000 | 232.486877441 | |||||
| Die Attach Total: | 0.000915 | 1000000 | 928.932250977 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.159802 | 240000 | 162235.25 | |||
| Bromine (Br) | 40039-93-8 | 0.006658 | 10000 | 6759.37841797 | ||||
| Silica (SiO2) | 60676-86-0 | 0.479406 | 720000 | 486705.71875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.019975 | 30000 | 20279.1503906 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.665841 | 1000000 | 675979.4375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000500 | 1000000 | 507.61328125 | ||
| TOTAL MASS (g): | 0.985002 | |||||||