LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1469IS8-2#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-16 17:24:15) | TOTAL MASS (g): | 0.134157 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003222 | 1000000 | 24016.5566406 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000134 | 1000000 | 998.82635498 | ||
| Lead Frame | A42 | Copper (Cu) | 7440-50-8 | 0.000000 | 0 | 0 | ||
| Iron (Fe) | 7439-89-6 | 0.025972 | 580000 | 193593.421875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.018808 | 420000 | 140193.484375 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.044780 | 1000000 | 333786.90625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002585 | 1000000 | 19271.6660156 | ||||
| External Plating Total: | 0.002585 | 1000000 | 19271.6660156 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000358 | 1000000 | 2668.50634766 | ||||
| Internal Plating Total: | 0.000358 | 1000000 | 2668.50634766 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000948 | 750000 | 7066.32373047 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000316 | 250000 | 2355.44116211 | |||||
| Die Attach Total: | 0.001264 | 1000000 | 9421.76464844 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.010590 | 130000 | 78937.1015625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.067613 | 830000 | 503982.4375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.002851 | 35000 | 21251.1503906 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000407 | 5000 | 3033.7487793 | ||||
| Encapsulation Total: | 0.081461 | 1000000 | 607204.4375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000353 | 1000000 | 2631.23681641 | ||
| TOTAL MASS (g): | 0.134157 | |||||||