LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1460JCS3-5#PBF | (Engineering Calculation) | SOT-23 | ||||||
| (printed on: 2017-03-16 23:37:11) | TOTAL MASS (g): | 0.013164 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000481 | 1000000 | 36538.46875 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu [HD] | Copper (Cu) | 7440-50-8 | 0.003510 | 975000 | 266632.0625 | ||
| Iron (Fe) | 7439-89-6 | 0.000083 | 23000 | 6304.97460938 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000001 | 400 | 75.9635543823 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000006 | 1600 | 455.781311035 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.003600 | 1000000 | 273468.75 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000227 | 1000000 | 17259.5253906 | ||||
| External Plating Total: | 0.000227 | 1000000 | 17259.5253906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000036 | 1000000 | 2734.68798828 | ||||
| Internal Plating Total: | 0.000036 | 1000000 | 2734.68798828 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000281 | 750000 | 21345.7578125 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000094 | 250000 | 7140.57421875 | |||||
| Die Attach Total: | 0.000375 | 1000000 | 28486.3320312 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.000488 | 58000 | 37070.2109375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.007485 | 890000 | 568587.1875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000421 | 50000 | 31980.65625 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000017 | 2000 | 1291.38037109 | ||||
| Encapsulation Total: | 0.008411 | 1000000 | 638929.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000034 | 1000000 | 2582.76074219 | ||
| TOTAL MASS (g): | 0.013164 | |||||||