LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1371HVCT7#PBF | (Engineering Calculation) | TO-220 | ||||||
| (printed on: 2017-03-17 16:15:20) | TOTAL MASS (g): | 2.023289 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004354 | 1000000 | 2151.94165039 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 1.457910 | 998500 | 720564.3125 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.002190 | 1500 | 1082.39587402 | ||||
| Lead Frame Total: | 1.460100 | 1000000 | 721646.75 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012534 | 1000000 | 6195.015625 | ||||
| External Plating Total: | 0.012534 | 1000000 | 6195.015625 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.017000 | 893796 | 8402.16015625 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002020 | 106203.992188 | 998.374328613 | ||||
| Internal Plating Total: | 0.019020 | 1000000 | 9400.53417969 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000103 | 50000 | 50.9072036743 | ||||
| Lead (Pb) | 7439-92-1 | 0.001958 | 950000 | 967.731201172 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.002061 | 1000000 | 1018.6383667 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.053828 | 103000 | 26604.2050781 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.467727 | 895000 | 231171.609375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001045 | 2000 | 516.485778809 | ||||
| Encapsulation Total: | 0.522600 | 1000000 | 258292.28125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000430 | 1000000 | 212.525222778 | ||
| TOTAL MASS (g): | 2.023289 | |||||||