LINEAR TECHNOLOGY MATERIALS DECLARATION

LT1353CS#PBF (Engineering Calculation) SOIC  
(printed on: 2017-03-16 17:23:06) TOTAL MASS (g): 0.135116
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.003996 1000000 29574.4902344
Die Coat Dow Corning Silicone 69430-27-9 0.000166 1000000 1228.56994629
Lead Frame A42 Copper (Cu) 7440-50-8 0.000000 0 0
Iron (Fe) 7439-89-6 0.025972 580000 192219.375
Phosphorus (P) 7723-14-0 0.000000 0 0
Zinc (Zn) 7440-66-6 0.000000 0 0
Nickel (Ni) 7440-02-0 0.018808 420000 139198.453125
Silicon (Si) 7440-21-3 0.000000 0 0
Magnesium (Mg) 7439-95-4 0.000000 0 0
Tin (Sn) 7440-31-5 0.000000 0 0
Lead Frame Total: 0.044780 1000000 331417.84375
Plating PMI Exter. Plating Pb 7439-92-1 0.000000 0 0
Exter. Plating Sn 7440-31-5 0.002585 1000000 19134.8847656
External Plating Total: 0.002585 1000000 19134.8847656
Inter. Plating Ni 7440-02-0 0.000000 0 0
Inter. Plating Ag 7440-22-4 0.000358 1000000 2649.56640625
Internal Plating Total: 0.000358 1000000 2649.56640625
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.001109 750000 8207.734375
Tin (Sn) 7440-31-5 0.000000 0 0
Lead (Pb) 7439-92-1 0.000000 0 0
Silica (SiO2) 60676-86-0 0.000000 0 0
Indium (In) 7440-74-6 0.000000 0 0
Metal Oxide   0.000000 0 0
Antimony (Sb) 7440-36-0 0.000000 0 0
Resin (EP)   0.000370 250000 2738.37866211
Die Attach Total: 0.001479 1000000 10946.1132812
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.010582 130000 78317.6328125
Bromine (Br) 40039-93-8 0.000000 0 0
Silica (SiO2) 60676-86-0 0.067561 830000 500020.5625
Antimony
Trioxide (Sb2O3)
1309-64-4 0.000000 0 0
Metal Hydroxide   0.002849 35000 21085.5175781
Carbon Black (C) 1333-86-4 0.000407 5000 3012.21655273
Encapsulation Total: 0.081399 1000000 602435.9375
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000353 1000000 2612.56152344
  TOTAL MASS (g): 0.135116