LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT1268CQ#PBF | (Engineering Calculation) | DDPAK | ||||||
| (printed on: 2017-03-17 22:34:32) | TOTAL MASS (g): | 1.407607 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.008109 | 1000000 | 5760.83984375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.852419 | 998500 | 605580.125 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.001281 | 1500 | 910.054992676 | ||||
| Lead Frame Total: | 0.853700 | 1000000 | 606490.1875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.009978 | 1000000 | 7088.78027344 | ||||
| External Plating Total: | 0.009978 | 1000000 | 7088.78027344 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.004000 | 740740.75 | 2841.7019043 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001400 | 259259.265625 | 994.595581055 | ||||
| Internal Plating Total: | 0.005400 | 1000000 | 3836.29760742 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000163 | 50000 | 115.799354553 | ||||
| Lead (Pb) | 7439-92-1 | 0.003104 | 950000 | 2205.16064453 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.003267 | 1000000 | 2320.95996094 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.053704 | 103000 | 38152.6914062 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466653 | 895000 | 331522.15625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001043 | 2000 | 740.973815918 | ||||
| Encapsulation Total: | 0.521400 | 1000000 | 370415.8125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.004472 | 1000000 | 3177.02270508 | ||
| TOTAL MASS (g): | 1.407607 | |||||||