LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1254CN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 00:33:46) | TOTAL MASS (g): | 0.984581 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001609 | 1000000 | 1634.19799805 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.284310 | 975000 | 288762.5 | ||
| Iron (Fe) | 7439-89-6 | 0.006998 | 24000 | 7107.59375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000087 | 300 | 88.3624725342 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000204 | 700 | 207.194763184 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.291599 | 1000000 | 296165.65625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.021727 | 1000000 | 22067.0175781 | ||||
| External Plating Total: | 0.021727 | 1000000 | 22067.0175781 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002333 | 1000000 | 2369.53637695 | ||||
| Internal Plating Total: | 0.002333 | 1000000 | 2369.53637695 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000610 | 750000 | 619.552978516 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000203 | 250000 | 206.179122925 | |||||
| Die Attach Total: | 0.000813 | 1000000 | 825.732116699 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.159840 | 240000 | 162343.203125 | |||
| Bromine (Br) | 40039-93-8 | 0.006660 | 10000 | 6764.30029297 | ||||
| Silica (SiO2) | 60676-86-0 | 0.479520 | 720000 | 487029.59375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.019980 | 30000 | 20292.9003906 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.666000 | 1000000 | 676430 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000500 | 1000000 | 507.830352783 | ||
| TOTAL MASS (g): | 0.984581 | |||||||