LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1237CSW#PBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-17 22:23:34) | TOTAL MASS (g): | 0.752291 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006539 | 1000000 | 8692.11132812 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.185240 | 975000 | 246234.375 | ||
| Iron (Fe) | 7439-89-6 | 0.004560 | 24000 | 6061.48095703 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000057 | 300 | 75.7685089111 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000133 | 700 | 176.793197632 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.189990 | 1000000 | 252548.421875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.008359 | 1000000 | 11111.8662109 | ||||
| External Plating Total: | 0.008359 | 1000000 | 11111.8662109 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001513 | 1000000 | 2011.1887207 | ||||
| Internal Plating Total: | 0.001513 | 1000000 | 2011.1887207 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001611 | 750000 | 2141.45751953 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000537 | 250000 | 713.819152832 | |||||
| Die Attach Total: | 0.002148 | 1000000 | 2855.27661133 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.073286 | 135000 | 97417.03125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466860 | 860000 | 620584 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.002714 | 5000 | 3607.64477539 | ||||
| Encapsulation Total: | 0.542860 | 1000000 | 721608.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000882 | 1000000 | 1172.41809082 | ||
| TOTAL MASS (g): | 0.752291 | |||||||