LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1182IS#PBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-17 22:30:32) | TOTAL MASS (g): | 0.16198 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007845 | 1000000 | 48431.9960938 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.051070 | 975000 | 315286.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.001257 | 24000 | 7760.23144531 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000016 | 300 | 98.7778015137 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000037 | 700 | 228.423690796 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.052380 | 1000000 | 323373.84375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.002954 | 1000000 | 18235.0253906 | ||||
| External Plating Total: | 0.002954 | 1000000 | 18235.0253906 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000419 | 1000000 | 2586.74389648 | ||||
| Internal Plating Total: | 0.000419 | 1000000 | 2586.74389648 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001908 | 750000 | 11779.2529297 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000636 | 250000 | 3926.41772461 | |||||
| Die Attach Total: | 0.002544 | 1000000 | 15705.6708984 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb Free | Resin (EP) | 0.009816 | 103000 | 60600.1875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.085294 | 895000 | 526572.1875 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000191 | 2000 | 1179.16003418 | ||||
| Encapsulation Total: | 0.095301 | 1000000 | 588351.5 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000537 | 1000000 | 3315.23022461 | ||
| TOTAL MASS (g): | 0.161980 | |||||||