LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1175CS8#TRPBF | (Engineering Calculation) | SOIC | ||||||
| (printed on: 2017-03-18 13:24:37) | TOTAL MASS (g): | 0.072753 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001595 | 1000000 | 21923.5410156 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.023653 | 975000 | 325114.4375 | ||
| Iron (Fe) | 7439-89-6 | 0.000582 | 24000 | 7999.68652344 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000007 | 300 | 96.2161636353 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000017 | 700 | 233.667831421 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.024259 | 1000000 | 333443.96875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001477 | 1000000 | 20299.5761719 | ||||
| External Plating Total: | 0.001477 | 1000000 | 20299.5761719 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000068 | 1000000 | 934.671325684 | ||||
| Internal Plating Total: | 0.000068 | 1000000 | 934.671325684 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000591 | 750000 | 8123.39306641 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000197 | 250000 | 2707.79785156 | |||||
| Die Attach Total: | 0.000788 | 1000000 | 10831.1914062 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.006657 | 150000 | 91501.5703125 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.036392 | 820000 | 500214.09375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.001110 | 25000 | 15257.1337891 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000222 | 5000 | 3051.42700195 | ||||
| Encapsulation Total: | 0.044381 | 1000000 | 610024.1875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000185 | 1000000 | 2542.85571289 | ||
| TOTAL MASS (g): | 0.072753 | |||||||