LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1171HVCQ#TRPBF | (Engineering Calculation) | DDPAK | ||||||
| (printed on: 2017-03-17 03:37:23) | TOTAL MASS (g): | 1.400933 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005902 | 1000000 | 4212.90625 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.852419 | 998500 | 608465.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.001281 | 1500 | 914.39050293 | ||||
| Lead Frame Total: | 0.853700 | 1000000 | 609379.5 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.009978 | 1000000 | 7122.55126953 | ||||
| External Plating Total: | 0.009978 | 1000000 | 7122.55126953 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.004000 | 740740.75 | 2855.23999023 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001400 | 259259.265625 | 999.33392334 | ||||
| Internal Plating Total: | 0.005400 | 1000000 | 3854.57373047 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000128 | 50000 | 91.3676681519 | ||||
| Lead (Pb) | 7439-92-1 | 0.002437 | 950000 | 1739.55480957 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.002565 | 1000000 | 1830.92248535 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.053704 | 103000 | 38334.4492188 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466653 | 895000 | 333101.53125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001043 | 2000 | 744.50378418 | ||||
| Encapsulation Total: | 0.521400 | 1000000 | 372180.5 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001988 | 1000000 | 1419.05407715 | ||
| TOTAL MASS (g): | 1.400933 | |||||||