LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1141ACN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 22:32:24) | TOTAL MASS (g): | 1.583961 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004223 | 1000000 | 2666.10083008 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.458357 | 975000 | 289373.9375 | ||
| Iron (Fe) | 7439-89-6 | 0.011283 | 24000 | 7123.28125 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000141 | 300 | 89.0173416138 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000329 | 700 | 207.707138062 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.470110 | 1000000 | 296793.90625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.037246 | 1000000 | 23514.4765625 | ||||
| External Plating Total: | 0.037246 | 1000000 | 23514.4765625 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.003761 | 1000000 | 2374.42724609 | ||||
| Internal Plating Total: | 0.003761 | 1000000 | 2374.42724609 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001173 | 750000 | 740.548522949 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000391 | 250000 | 246.849517822 | |||||
| Die Attach Total: | 0.001564 | 1000000 | 987.398071289 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.143937 | 135000 | 90871.5546875 | |||
| Bromine (Br) | 40039-93-8 | 0.007463 | 7000 | 4711.60546875 | ||||
| Silica (SiO2) | 60676-86-0 | 0.895608 | 840000 | 565423 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.013861 | 13000 | 8750.84667969 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.005331 | 5000 | 3365.61303711 | ||||
| Encapsulation Total: | 1.066200 | 1000000 | 673122.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000857 | 1000000 | 541.04864502 | ||
| TOTAL MASS (g): | 1.583961 | |||||||