LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1137AISW#TRPBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-17 22:55:18) | TOTAL MASS (g): | 0.750722 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005851 | 1000000 | 7793.82714844 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.184353 | 975000 | 245567.46875 | ||
| Iron (Fe) | 7439-89-6 | 0.004538 | 24000 | 6044.84472656 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000057 | 300 | 75.9268722534 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000132 | 700 | 175.8306427 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.189080 | 1000000 | 251864.078125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.008359 | 1000000 | 11135.0888672 | ||||
| External Plating Total: | 0.008359 | 1000000 | 11135.0888672 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001513 | 1000000 | 2015.39233398 | ||||
| Internal Plating Total: | 0.001513 | 1000000 | 2015.39233398 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001482 | 750000 | 1974.09863281 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000494 | 250000 | 658.032897949 | |||||
| Die Attach Total: | 0.001976 | 1000000 | 2632.1315918 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.081459 | 150000 | 108507.492188 | |||
| Bromine (Br) | 40039-93-8 | 0.005431 | 10000 | 7234.36572266 | ||||
| Silica (SiO2) | 60676-86-0 | 0.439879 | 810000 | 585941 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.016292 | 30000 | 21701.765625 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.543061 | 1000000 | 723384.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000882 | 1000000 | 1174.8684082 | ||
| TOTAL MASS (g): | 0.750722 | |||||||