LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT1136ACNW#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-17 22:33:02) | TOTAL MASS (g): | 4.294192 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.006856 | 1000000 | 1596.57519531 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 1.296750 | 975000 | 301977.625 | ||
| Iron (Fe) | 7439-89-6 | 0.031920 | 24000 | 7433.296875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000399 | 300 | 92.9162063599 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000931 | 700 | 216.804473877 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 1.330000 | 1000000 | 309720.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.043454 | 1000000 | 10119.1396484 | ||||
| External Plating Total: | 0.043454 | 1000000 | 10119.1396484 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.010640 | 1000000 | 2477.76538086 | ||||
| Internal Plating Total: | 0.010640 | 1000000 | 2477.76538086 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001682 | 750000 | 391.691864014 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000561 | 250000 | 130.641586304 | |||||
| Die Attach Total: | 0.002243 | 1000000 | 522.333496094 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.391500 | 135000 | 91169.65625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 2.494000 | 860000 | 580784.5 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.014500 | 5000 | 3376.65380859 | ||||
| Encapsulation Total: | 2.900000 | 1000000 | 675330.8125 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000999 | 1000000 | 232.639831543 | ||
| TOTAL MASS (g): | 4.294192 | |||||||