LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1123CST#TRPBF | (Engineering Calculation) | SOT-223 | ||||||
| (printed on: 2017-03-16 17:45:49) | TOTAL MASS (g): | 0.114335 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001214 | 1000000 | 10617.8847656 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.062693 | 975000 | 548325.375 | ||
| Iron (Fe) | 7439-89-6 | 0.001543 | 24000 | 13495.3837891 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000019 | 300 | 166.177749634 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000045 | 700 | 393.578887939 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.064300 | 1000000 | 562380.5625 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.001609 | 1000000 | 14076.0439453 | ||||
| External Plating Total: | 0.001609 | 1000000 | 14076.0439453 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000514 | 1000000 | 4495.54589844 | ||||
| Internal Plating Total: | 0.000514 | 1000000 | 4495.54589844 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000496 | 750000 | 4338.11425781 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000165 | 250000 | 1443.12280273 | |||||
| Die Attach Total: | 0.000661 | 1000000 | 5781.23681641 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.004738 | 103000 | 41439.4882812 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.041170 | 895000 | 360081 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000092 | 2000 | 804.650268555 | ||||
| Encapsulation Total: | 0.046000 | 1000000 | 402325.09375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000037 | 1000000 | 323.609344482 | ||
| TOTAL MASS (g): | 0.114335 | |||||||