LINEAR TECHNOLOGY MATERIALS DECLARATION |
||||||||
|---|---|---|---|---|---|---|---|---|
| LT1076IQ#PBF | (Engineering Calculation) | DDPAK | ||||||
| (printed on: 2017-03-17 04:26:12) | TOTAL MASS (g): | 1.402285 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.005956 | 1000000 | 4247.35302734 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.852419 | 998500 | 607878.5 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.001281 | 1500 | 913.508850098 | ||||
| Lead Frame Total: | 0.853700 | 1000000 | 608791.9375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.009978 | 1000000 | 7115.68359375 | ||||
| External Plating Total: | 0.009978 | 1000000 | 7115.68359375 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.004000 | 740740.75 | 2852.48681641 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001400 | 259259.265625 | 998.370361328 | ||||
| Internal Plating Total: | 0.005400 | 1000000 | 3850.85717773 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000129 | 50000 | 91.99269104 | ||||
| Lead (Pb) | 7439-92-1 | 0.002453 | 950000 | 1749.28759766 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.002582 | 1000000 | 1841.28027344 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.053704 | 103000 | 38297.4882812 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.466653 | 895000 | 332780.375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001043 | 2000 | 743.785949707 | ||||
| Encapsulation Total: | 0.521400 | 1000000 | 371821.65625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.001988 | 1000000 | 1417.68591309 | ||
| TOTAL MASS (g): | 1.402285 | |||||||