LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1074HVCT7#06PBF | (Engineering Calculation) | TO-220 | ||||||
| (printed on: 2017-03-17 03:57:26) | TOTAL MASS (g): | 2.025963 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.007784 | 1000000 | 3842.12280273 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 1.457910 | 998500 | 719613.1875 | ||
| Iron (Fe) | 7439-89-6 | 0.000000 | 0 | 0 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.002190 | 1500 | 1080.96728516 | ||||
| Lead Frame Total: | 1.460100 | 1000000 | 720694.25 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012534 | 1000000 | 6186.83886719 | ||||
| External Plating Total: | 0.012534 | 1000000 | 6186.83886719 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.017000 | 893796 | 8391.0703125 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002020 | 106203.992188 | 997.05657959 | ||||
| Internal Plating Total: | 0.019020 | 1000000 | 9388.12597656 | |||||
| Die Attach | 95Pb / 5 Sn | Silver (Ag) | 7440-22-4 | 0.000000 | 0 | 0 | ||
| Tin (Sn) | 7440-31-5 | 0.000158 | 50000 | 77.9875946045 | ||||
| Lead (Pb) | 7439-92-1 | 0.003002 | 950000 | 1481.76428223 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000000 | 0 | 0 | |||||
| Die Attach Total: | 0.003160 | 1000000 | 1559.75195312 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.053828 | 103000 | 26569.0898438 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.467727 | 895000 | 230866.484375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001045 | 2000 | 515.804016113 | ||||
| Encapsulation Total: | 0.522600 | 1000000 | 257951.34375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000765 | 1000000 | 377.598175049 | ||
| TOTAL MASS (g): | 2.025963 | |||||||