LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT1039ACSW#PBF | (Engineering Calculation) | SOIC WIDE | ||||||
| (printed on: 2017-03-17 22:21:11) | TOTAL MASS (g): | 0.51139 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.003365 | 1000000 | 6580.109375 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.161470 | 975000 | 315747.46875 | ||
| Iron (Fe) | 7439-89-6 | 0.003975 | 24000 | 7772.93798828 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000050 | 300 | 97.7727966309 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000116 | 700 | 226.832901001 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.165611 | 1000000 | 323845.03125 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005671 | 1000000 | 11088.8681641 | ||||
| External Plating Total: | 0.005671 | 1000000 | 11088.8681641 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001325 | 1000000 | 2590.97924805 | ||||
| Internal Plating Total: | 0.001325 | 1000000 | 2590.97924805 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000986 | 750000 | 1928.07971191 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000329 | 250000 | 643.345031738 | |||||
| Die Attach Total: | 0.001315 | 1000000 | 2571.42480469 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.045043 | 135000 | 88079.6015625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.286939 | 860000 | 561096.5625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001668 | 5000 | 3261.70043945 | ||||
| Encapsulation Total: | 0.333650 | 1000000 | 652437.875 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000453 | 1000000 | 885.821533203 | ||
| TOTAL MASS (g): | 0.511390 | |||||||