LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LT1029CZ#TRPBF | (Engineering Calculation) | TO-92 | ||||||
| (printed on: 2017-03-16 23:43:32) | TOTAL MASS (g): | 0.206147 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002733 | 1000000 | 13257.5166016 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.088433 | 975000 | 428979.84375 | ||
| Iron (Fe) | 7439-89-6 | 0.002177 | 24000 | 10560.4150391 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000027 | 300 | 130.974365234 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000063 | 700 | 305.606842041 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.090700 | 1000000 | 439976.84375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005680 | 1000000 | 27554.0957031 | ||||
| External Plating Total: | 0.005680 | 1000000 | 27554.0957031 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000320 | 1000000 | 1552.28881836 | ||||
| Internal Plating Total: | 0.000320 | 1000000 | 1552.28881836 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000848 | 750000 | 4113.56542969 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000283 | 250000 | 1372.80541992 | |||||
| Die Attach Total: | 0.001131 | 1000000 | 5486.37060547 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.014243 | 135000 | 69091.3984375 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.090730 | 860000 | 440122.375 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000528 | 5000 | 2561.27661133 | ||||
| Encapsulation Total: | 0.105501 | 1000000 | 511775.0625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000082 | 1000000 | 397.773986816 | ||
| TOTAL MASS (g): | 0.206147 | |||||||