LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1027BCN8-5#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 23:40:08) | TOTAL MASS (g): | 0.501384 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.004311 | 1000000 | 8598.19433594 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.001032 | 1000000 | 2058.30102539 | ||
| Lead Frame | A42 | Copper (Cu) | 7440-50-8 | 0.000000 | 0 | 0 | ||
| Iron (Fe) | 7439-89-6 | 0.089088 | 580000 | 177684.046875 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.064512 | 420000 | 128667.773438 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.153600 | 1000000 | 306351.84375 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.012410 | 1000000 | 24752.0527344 | ||||
| External Plating Total: | 0.012410 | 1000000 | 24752.0527344 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.001228 | 1000000 | 2449.21899414 | ||||
| Internal Plating Total: | 0.001228 | 1000000 | 2449.21899414 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.001169 | 750000 | 2331.54492188 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000390 | 250000 | 777.846435547 | |||||
| Die Attach Total: | 0.001559 | 1000000 | 3109.39135742 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.044139 | 135000 | 88034.265625 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.281184 | 860000 | 560815.25 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.001635 | 5000 | 3260.97143555 | ||||
| Encapsulation Total: | 0.326958 | 1000000 | 652110.5 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000286 | 1000000 | 570.420715332 | ||
| TOTAL MASS (g): | 0.501384 | |||||||