LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LT1024ACN#PBF | (Engineering Calculation) | PDIP | ||||||
| (printed on: 2017-03-16 17:26:55) | TOTAL MASS (g): | 0.985173 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.002238 | 1000000 | 2271.68261719 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000536 | 1000000 | 544.067016602 | ||
| Lead Frame | A42 | Copper (Cu) | 7440-50-8 | 0.000000 | 0 | 0 | ||
| Iron (Fe) | 7439-89-6 | 0.169128 | 580000 | 171673.4375 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000000 | 0 | 0 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000000 | 0 | 0 | ||||
| Nickel (Ni) | 7440-02-0 | 0.122472 | 420000 | 124315.25 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.291600 | 1000000 | 295988.6875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.021727 | 1000000 | 22053.7578125 | ||||
| External Plating Total: | 0.021727 | 1000000 | 22053.7578125 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.002333 | 1000000 | 2368.11254883 | ||||
| Internal Plating Total: | 0.002333 | 1000000 | 2368.11254883 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000740 | 750000 | 751.137268066 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000247 | 250000 | 250.717422485 | |||||
| Die Attach Total: | 0.000987 | 1000000 | 1001.85467529 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.159660 | 240000 | 162062.921875 | |||
| Bromine (Br) | 40039-93-8 | 0.006653 | 10000 | 6753.12988281 | ||||
| Silica (SiO2) | 60676-86-0 | 0.478981 | 720000 | 486189.8125 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.019958 | 30000 | 20258.3769531 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.665252 | 1000000 | 675264.25 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000500 | 1000000 | 507.525177002 | ||
| TOTAL MASS (g): | 0.985173 | |||||||