LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LM336Z-2.5#PBF | (Engineering Calculation) | TO-92 | ||||||
| (printed on: 2017-03-17 22:33:09) | TOTAL MASS (g): | 0.204246 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.001237 | 1000000 | 6056.41601562 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.088433 | 975000 | 432972.53125 | ||
| Iron (Fe) | 7439-89-6 | 0.002177 | 24000 | 10658.7050781 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000027 | 300 | 132.193389893 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000063 | 700 | 308.45123291 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.090700 | 1000000 | 444071.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005680 | 1000000 | 27810.5507812 | ||||
| External Plating Total: | 0.005680 | 1000000 | 27810.5507812 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000320 | 1000000 | 1566.7364502 | ||||
| Internal Plating Total: | 0.000320 | 1000000 | 1566.7364502 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000502 | 750000 | 2457.81787109 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000167 | 250000 | 817.640686035 | |||||
| Die Attach Total: | 0.000669 | 1000000 | 3275.45849609 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.014243 | 135000 | 69734.46875 | |||
| Bromine (Br) | 40039-93-8 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.090730 | 860000 | 444218.75 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.000000 | 0 | 0 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000528 | 5000 | 2585.11547852 | ||||
| Encapsulation Total: | 0.105501 | 1000000 | 516538.375 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000139 | 1000000 | 680.551147461 | ||
| TOTAL MASS (g): | 0.204246 | |||||||