LINEAR TECHNOLOGY MATERIALS DECLARATION |
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|---|---|---|---|---|---|---|---|---|
| LM334Z#PBF | (Engineering Calculation) | TO-92 | ||||||
| (printed on: 2017-03-17 16:44:17) | TOTAL MASS (g): | 0.203395 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
||
| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000661 | 1000000 | 3249.83105469 | ||
| Die Coat | Dow Corning | Silicone | 69430-27-9 | 0.000000 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.088433 | 975000 | 434784.09375 | ||
| Iron (Fe) | 7439-89-6 | 0.002177 | 24000 | 10703.3007812 | ||||
| Phosphorus (P) | 7723-14-0 | 0.000027 | 300 | 132.746505737 | ||||
| Zinc (Zn) | 7440-66-6 | 0.000063 | 700 | 309.741821289 | ||||
| Nickel (Ni) | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0.000000 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0.000000 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead Frame Total: | 0.090700 | 1000000 | 445929.875 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0.000000 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.005680 | 1000000 | 27926.9101562 | ||||
| External Plating Total: | 0.005680 | 1000000 | 27926.9101562 | |||||
| Inter. Plating Ni | 7440-02-0 | 0.000000 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000320 | 1000000 | 1573.29174805 | ||||
| Internal Plating Total: | 0.000320 | 1000000 | 1573.29174805 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000339 | 750000 | 1666.70593262 | ||
| Tin (Sn) | 7440-31-5 | 0.000000 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0.000000 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.000000 | 0 | 0 | ||||
| Indium (In) | 7440-74-6 | 0.000000 | 0 | 0 | ||||
| Metal Oxide | 0.000000 | 0 | 0 | |||||
| Antimony (Sb) | 7440-36-0 | 0.000000 | 0 | 0 | ||||
| Resin (EP) | 0.000113 | 250000 | 555.568664551 | |||||
| Die Attach Total: | 0.000452 | 1000000 | 2222.2746582 | |||||
| Encapsulation | FILLED EPOXY RESIN | Resin (EP) | 0.025320 | 240000 | 124486.710938 | |||
| Bromine (Br) | 40039-93-8 | 0.001055 | 10000 | 5186.94628906 | ||||
| Silica (SiO2) | 60676-86-0 | 0.075960 | 720000 | 373460.15625 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0.003165 | 30000 | 15560.8388672 | ||||
| Metal Hydroxide | 0.000000 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 0.000000 | 0 | 0 | ||||
| Encapsulation Total: | 0.105500 | 1000000 | 518694.625 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 0.000082 | 1000000 | 403.156005859 | ||
| TOTAL MASS (g): | 0.203395 | |||||||