Lead (Pb) Free Program and RoHS Compliance Information
- Our products with a #PBF or #TRPBF are RoHS and WEEE compliant.
- Matte Tin and gold are our Lead-Free terminal finishes.
- Gold is used for our uModules package LGA interconnect.
- All Matte Tin and gold products are marked with a special identifier on the top mark and labels.
- Matte Tin terminal finish is available on all our products under special flow #PBF or #TRPBF.
- Gold terminal finish is available on uModules under special flow #PBF.
- Matte Tin or gold terminal finish is backward and forward compatible with the industry standard soldering conditions and solder paste for Leaded or Lead-Free terminal finish.
- For customers who do not plan on converting to Matte Tin, solder plated products will continue to be offered, special terms and conditions may apply.
See Below for Details
- Device Materials Declaration - Search, View and Download
- Lead (Pb) Free Program Status
- Selection of Matte Tin as a Lead (Pb) Free Alternative
- Ordering Lead (Pb) Free Products
- Ordering Lead (Pb) Free Samples
- Lead (Pb) Free Marking
- Electrical Performance
- Recommended Lead (Pb) Free Reflow / Soldering Temperature Profile
- Products with Lead-containing Die Attach Solder
- Availability of Solder Plated Products in the Future
- Summary of Matte Tin Qualification/Reliability Data
- Summary of Matte Tin Surface Mount Evaluation Results
- Mitigation of Tin Whisker Growth
- MSL Rating by Package Type
- LTC Environmental Policy
- RoHS Material Declaration Certificate
- Sony Green Partnership Certificate
- ISO14001 Certificate
- EU Directive 2002/95/EC
Selection of Matte Tin as a Lead (Pb) Free Alternative
Even though LTC has evaluated other Lead (Pb) Free alternatives (e.g., Palladium Nickel Gold) a decision was made to use Matte Tin for the following reasons. Matte Tin represents the best drop-in replacement since it is the most cost effective solution, has a lower reflow temperature ~240°C, is compatible with reflow soldering processes using PbSn and SnAgCu solder pastes, has excellent solder ability performance, and based on LTC’s extensive qualification/reliability testing has excellent reliability performance.
Ordering Lead (Pb) Free Parts
A Lead (Pb) Free Product can be ordered by adding the suffix #PBF or #TRPBF to the LTC part number.
Example 1:To order a part in tape and reel with a Lead (Pb) Free lead finish:
| Solder Plated Part | Lead (Pb) Free Part |
|---|---|
| LT1016CS8#TR | LT1016CS8#TRPBF |
| LTC3728EG#TR | LTC3728EG#TRPBF |
Example 2:To order a part in shipping tubes with a Lead (Pb) Free lead finish (TSOT, SC70, 2x2 DFN parts are not available in tubes):
| Solder Plated Part | Lead (Pb) Free Part |
|---|---|
| LT1016CS8 | LT1016CS8#PBF |
| LTC3728EG | LTC3728EG#PBF |
Example 3:To order a part with a Special Flow XX with a Lead (Pb) Free lead finish:
| Solder Plated Part | Lead (Pb) Free Part |
|---|---|
| LT1016CS8#XX | LT1016CS8#XXPBF |
Note: The full Lead (Pb) Free part number will also be marked on the container labels.
Ordering Lead (Pb) Free Samples
Find the product page on our website and click “Request Samples” in the upper right corner, or contact the nearest LTC Sales Office.
Lead (Pb) Free Marking
JEDEC Standard JESD97 defines various Lead (Pb) Free categories with symbols e1 through e7. The symbol e3 applies to products with a Matte Tin (Sn) terminal finish. Since LTC Lead (Pb) Free products have a Matte Tin (Sn) terminal finish, the symbol e3 is added to the product top marking of larger packages, where space permits. On packages that are too small to accommodate the e3, a “<” symbol is added to the device at the pin 1 location. Lead (Pb) free 2mm X 2mm and 3mm X 2mm packages are identified by rearranging the trace code marking of the device. These Lead (Pb) Free marking indicators were implemented starting with date code 0514. However, we will continue to ship Lead-Free product, from our existing stock, which was marked prior to 0514 without the indicator.
The e3 is marked on the same line as the date code or the trace code. There is no change to the line that contains the part number. This is a change to the top marking to better identify Lead (Pb) Free products and does not reflect any change to the form, fit or function of the products.
Electrical Performance and Datasheet
There is no difference in the electrical performance of the Pb Free devices compared to the original devices with solder plated terminal finish. Therefore, LTC will not need to issue new datasheets for Pb Free devices.
Recommended Lead (Pb) Free Reflow Profile
Matte Tin terminal finish can be soldered very well at 240°C to 250°C and does not require soldering above 250°C. Matter Tin finish terminal is backward and forward compatible with SnPb and SnAgCu solder paste. The soldering profile should conform to LTC’s recommended procedures for Surface Mount Products.
Products with Lead (Pb) Containing Die-Attach Solder
LTC builds a variety of packages, e.g., TO-220, SOT-223, DD Pak, etc. that use a lead (Pb) containing die-attach solder. This solder is exempt from current legislation due to the lack of a suitable replacement material, as defined in Article 4 of the EU Directive 2002/95/EC, Annex-section 7 (>85% lead, Pb, in high temperature melting point solders).
Availability of Solder Plated Products in the Future
LTC is fully aware that some customers, particularly those in the military, networking, and telecommunication industries, have concerns over the conversion to a Matte Tin (Sn) terminal finish. Since many of their products are exempt from current legislation, as defined in Article 4 of the EU Directive 2002/95/EC, Annex--section 7, as follows:
- Lead in solder for servers, storage and storage array systems (exemption granted until 2010),
- Lead in solder for network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications. Many of these customers can continue to accept product with a solder plated terminal finish. LTC plans to continue to offer products with a solder plated terminal finish to these customers for the foreseeable future.
Summary of Matte Tin Qualification Data
Mitigation of Tin Whisker Growth
LTC has conducted extensive long-term storage tests, namely 85°C/85%RH temperature/humidity testing and ~50°C/~60%RH storage testing, and has found LTC's Matte Tin terminal finish to be reliable, with whisker growth less than the industry acceptable size of 30 to 50 microns. The 50°C/60%RH long-term storage test has been conducted on some packages for close to 5 years with acceptable results.
In addition to excellent reliability test results, LTC has implemented the following to further mitigate Tin Whisker Growth:
- Maintain a minimum of 7.6 µm (300 µinches) tin-plating thickness; target 11.4 µm (450 µinches).
- Minimize organic brighteners in tin-plating bath.
- Plating anneal of 150°C for 1 hour immediately following the plating process. This anneal reduces stresses and promotes a more uniform growth of intermetallics.
Mold Compound Change for Higher Soldering Temperature Performance
LTC is in the process of completing qualification on new mold compounds that do not incorporate bromine and antimony trioxide as fire retardants. The new mold compounds will also improve the MSL Rating based on the higher 255°C, +5, -0°C reflow soldering tests.
Note: LTC has never used mold compounds containing Red Phosphorus, nor will we use them on these upcoming changes.
Hermetic Packages Excluded from Lead (Pb) Free
Please be advised that Linear Technology is not currently offering Pb Free terminal finish on D, H, J, K and W hermetic packages. There is not enough demand for the Pb Free terminal finish on these packages to justify the dedication of resources to develop Pb Free terminal finish. At this point, we are not positioned to support small orders for these packages. However, any major business opportunities should be discussed with a Linear Technology Sales Representative to explore the Pb Free alternatives.